Computational heat dissipation structure, computing device comprising same, mine

ABSTRACT

A computational heat dissipation structure includes a circuit board including a plurality of heating components; and a radiator provided corresponding to the circuit board; wherein a space between the adjacent heating components is negatively correlated with heat dissipation efficiency of a region where the adjacent heating components are located. Since the space between the adjacent heating components of the disclosure is negatively correlated with the heat dissipation efficiency of the region where the adjacent heating components are located, i.e., the higher the heat dissipation efficiency of the region where the adjacent heating components are located is, the smaller the space between the adjacent heating components in the region will be, the heat dissipation efficiencies corresponding to the heating components are balanced, and load of a fan is reduced.

CROSS REFERENCE TO RELATED APPLICATION

This application is a continuation application of U.S. patentapplication Ser. No. 16/614,054 filed on Nov. 15, 2019, which is anational phase application of International Application No.PCT/CN2018/083956, filed with the China National Intellectual PropertyAdministration (CNIPA) on Apr. 20, 2018. International Application No.PCT/CN2018/083956 claims priority to and benefits of Chinese PatentApplication No. 201710353744.5, filed with the CNIPA on May 18, 2017.The entire contents of all of the above-identified applications areincorporated herein by reference.

BACKGROUND OF THE INVENTION 1. Field of the Invention

The disclosure relates to heat dissipation, and specifically to acomputing device and a computational heat dissipation structure thereof.The disclosure further relates to a mine formed of a plurality of thecomputing devices.

2. Related Art

In modern computing devices, component integration becomes higher, thenumber of components deployed on the devices is also increasing, andduring operation of the device, the heat generated is also increasing.In a high temperature environment, poor heat dissipation of thecomponents, or uneven heat dissipation of the components at differentpositions will cause working instability, reduced performance, andshorter working life of the entire circuit. Therefore, the moderncomputing device has a high requirement for heat dissipation.

Currently, the heat dissipation method is air cooling. Radiators made ofa material with high thermal conductive efficiency are mounted on thehigh heating components, and then active heat dissipation is carried outthrough a fan. For example, the Chinese patent for utility model No.ZL201520353408.7 discloses a chip heat dissipation device, a virtualdigital coin digger and a computing device, wherein the chip heatdissipation device comprises a chip welded onto a front of a printedcircuit board, a first radiator connected to a top of the chip fordissipating heat, and a second radiator connected to a back of theprinted circuit board and a part corresponding to a bottom of the chipfor dissipating heat, and a fan is located on both sides of a case ofthe virtual digital coin digger to take away heat generated by the chipin working, and ensure normal working of the digger.

However, in the prior art, since the chip components are deployed on thecircuit board in an equal space, and positions relative to the air ductare different, a temperature difference between an air inlet and an airoutlet is relatively large, and a temperature equalization effect ispoor. On such basis, air flowing speed is often increased by increasingrotation speed of the fan, thereby ensuring that the temperature in thehottest region satisfies use requirement, but such method also increasesload of the fan.

SUMMARY OF THE INVENTION

The technical problem to be solved by the disclosure is to provide acomputational heat dissipation structure, and a computing devicecomprising same, and a mine that can balance heat dissipationefficiencies corresponding to respective heating components, and reduceload of a fan.

To solve the above technical problem, the computational heat dissipationstructure of the disclosure comprises a circuit board comprising aplurality of heating components; and a radiator provided correspondingto the circuit board; wherein a space between the adjacent heatingcomponents is negatively correlated with heat dissipation efficiency ofa region where the adjacent heating components are located.

In one embodiment of the computational heat dissipation structure, thecircuit board comprises a first side face and a second side face,wherein when the circuit board is in a working state, an output heat ofthe first side face is larger than that of the second side face.

In one embodiment of the computational heat dissipation structure, theradiator comprises a main heat sink carrying the circuit board; and anauxiliary heat sink pressing the circuit board against the main heatsink tightly.

In one embodiment of the computational heat dissipation structure, theauxiliary heat sink presses the circuit board against the main heat sinkby way of resilient press.

In one embodiment of the computational heat dissipation structure, athermal conductive material is filled in a gap between the auxiliaryheat sink and the circuit board.

In one embodiment of the computational heat dissipation structure, thethermal conductive material is thermal conductive silicone grease orthermal conductive rubber pad.

In one embodiment of the computational heat dissipation structure, heatdissipation efficiency of the main heat sink is higher than that of theauxiliary heat sink, the main heat sink is provided corresponding to thefirst side face, and the auxiliary heat sink is provided correspondingto the second side face.

In one embodiment of the computational heat dissipation structure, themain heat sink comprises a first heat dissipation body comprising afirst surface and a second surface; and a first heat dissipation fin,wherein the first surface is connected to the first heat dissipationfin, and wherein the second surface is connected to the first side face.The auxiliary heat sink comprises a second heat dissipation bodycomprising a third surface and a fourth surface; and a second heatdissipation fin, wherein the third surface is connected to the secondheat dissipation fin, and wherein the fourth surface is connected to thesecond side face.

In one embodiment of the computational heat dissipation structure, thereis a plurality of the auxiliary heat sink, each corresponding to one ormore of the heating components.

The computing device of the disclosure comprises a device housingenclosing an enclosed heat-dissipation air duct, and further comprisingthe above computational heat dissipation structure, wherein thecomputational heat dissipation structure is located in theheat-dissipation air duct.

In one embodiment of the computing device, a temperature detecting unitfor measuring a temperature in the heat-dissipation air duct is mountedwithin the heat-dissipation air duct.

In one embodiment of the computing device, it further comprises acontroller comprising a fan control module; and a fan, the temperaturedetecting unit and the fan respectively electrically connected to thefan control module; wherein the fan control module adjusts dynamically arotation speed of the fan based on a real-time temperature in theheat-dissipation air duct detected by the temperature detecting unit.

In one embodiment of the computing device, the heat-dissipation air ductcomprises an air inlet mounted with a first panel assembly; and an airoutlet mounted with a second panel assembly; wherein the first panelassembly and the second panel assembly fix the radiator within theheat-dissipation air duct.

In one embodiment of the computing device, the fan comprises a first fanprovided at the air inlet and connected to the first panel assembly.

In one embodiment of the computing device, the fan comprises a secondfan provided at the air outlet and connected to the second panelassembly.

In one embodiment of the computing device, the heat-dissipation air ductcomprises a plurality of temperature zones, and wherein there is aplurality of the temperature detecting unit, each being provided inrespective temperature zones.

In one embodiment of the computing device, the controller furthercomprises a chip control module electrically connected to respectivetemperature detecting units, wherein the chip control module adjustsdynamically working frequencies of the heating components in respectivetemperature zones based on real-time temperature of the temperature zonedetected by respective temperature detecting unit.

In one embodiment of the computing device, there is at least one thecomputational heat dissipation structure.

The mine of the disclosure comprises at least one setting frame providedwith at least one computing device, wherein the computing device is theabove computing device.

As compared to the prior art, the disclosure has the followingadvantages: since the space between the adjacent heating components isnegatively correlated with the heat dissipation efficiency of the regionwhere the adjacent heating components are located, i.e., the higher theheat dissipation efficiency of the region where the adjacent heatingcomponents are located is, the smaller the space between the adjacentheating components in the region will be, the computational heatdissipation structure and the computing device provided by thedisclosure balance the heat dissipation efficiencies corresponding torespective heating components, and reduce load of the fan. Therefore,the mine provided by the disclosure avoids the problem of overheatingdamage of the heating components even if a large number of computingdevices are gathered in the same space.

Further, the disclosure dynamically controls efficiency of the fan andworking frequencies of the heating components within differenttemperature zones, further balance the heat dissipation efficiencies ofdifferent regions in the heat-dissipation air duct, and improve servicelife of the heating components, entire circuit and fan throughtemperature data fed back by the temperature detecting units.

Hereinafter the disclosure is explicitly described with reference to thedrawings and the detailed embodiments, but the disclosure is not limitedthereto.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a structure diagram of a computational heat dissipationstructure according to one embodiment of the disclosure.

FIG. 2 is a structure diagram of a computing device according to oneembodiment of the disclosure.

FIG. 3 is a deployment diagram of heating components on a circuit boardin the prior art.

FIG. 4 is a working effect diagram of the heating components on thecircuit board of FIG. 3 .

FIG. 5 is a deployment diagram of heating components on a circuit boardin the disclosure.

FIG. 6 is a working effect diagram of the heating components on thecircuit board of FIG. 5 .

FIG. 7 is a structure diagram of a computing device according to oneembodiment of the disclosure.

FIG. 8 is a structure diagram of a computing device according to oneembodiment of the disclosure.

FIG. 9 is a structure diagram of a computational heat dissipationstructure according to one embodiment of the disclosure.

FIG. 10 is a structure diagram of a computing device according to oneembodiment of the disclosure.

FIG. 11 is a structure diagram of a mine according to one embodiment ofthe disclosure.

PREFERABLE EMBODIMENTS OF THE INVENTION

Hereinafter the technical solution of the disclosure is explicitlydescribed with reference to the drawings and the detailed embodiments tofurther understand object, solution and effect of the disclosure,instead of limiting the scope protected by the appended claims of thedisclosure.

The disclosure discloses one or more embodiments containingcharacteristics of the disclosure. The disclosed embodiments are onlyfor exemplary explanation. The scope protected by the disclosure is notlimited to the disclosed embodiments. The disclosure is defined by theappended claims.

References of “one embodiment”, “an embodiment” and “exemplaryembodiment” in the specification refer to that the described embodimentcan comprise specific features, structures or characteristics, but notevery embodiment must comprise these specific features, structures orcharacteristics. In addition, such expression does not refer to the sameembodiment. Further, when the specific feature, structure orcharacteristic is described with reference to the embodiments, no matterwhether it is clearly described, it has shown that combination of suchspecific feature, structure or characteristic with other embodiments iswithin the knowledge range of those skilled in the art.

The specification and subsequent claims use some phrases to refer tospecific components or members, those ordinary in the art shallunderstand that technology users or manufacturers can use differentnouns or terms to call the same component or member. The specificationand subsequent claims do not distinguish the components or members bydifferent names, but distinguishing based on functional differences ofthe components or members as a criterion. “Comprising” and “including”mentioned in the whole specification and subsequent claims are openphrases, and shall be understood as “include but not limited to”. Inaddition, the word “connection” here includes any direct or indirectlyelectrical connection means. Indirect electrical connection meanscomprises connection through other device.

It shall be noted that terms of “transverse”, “vertical”, “up”, “down”,“front”, “back”, “left”, “right”, “upright”, “horizontal”, “top”,“bottom”, “in”, and “out” indicating orientation or position relationsin the disclosure are orientation or position relations based on thedrawings in order to facilitate describing the disclosure andsimplifying description only, rather than indicating or suggesting thatthe referred device or element must have a specific orientation, andstructured and operated in a specific orientation, so they cannot beunderstood as limitations to the disclosure.

FIG. 1 is a structure diagram of a computational heat dissipationstructure according to one embodiment of the disclosure. As shown inFIG. 1 and FIG. 5 , the computational heat dissipation structure 100comprises a circuit board 110 comprising a plurality of heatingcomponents 111, and a radiator 120, wherein a space between the adjacentheating components 111 is negatively correlated with heat dissipationefficiency of a region where the adjacent heating components 111 arelocated.

FIG. 2 is a structure diagram of a computing device according to oneembodiment of the disclosure, wherein the computing device comprises thecomputational heat dissipation structure illustrated in FIG. 1 .

As shown in FIG. 2 , the computing device 10 comprises a device housing11 enclosing an enclosed heat-dissipation air duct 12, and thecomputational heat dissipation structure 100, wherein the computationalheat dissipation structure 100 is located in the heat-dissipation airduct 12.

FIGS. 3 and 4 are deployment diagrams of heating components on a circuitboard in the prior art. As shown in the figures, a left side of thecircuit board 110A is close to an air outlet, and a right side is closeto an air inlet. As shown in FIG. 3 , a plurality of heating components111A deployed on the device are equally spaced, while a temperaturedifference between the air outlet and the air inlet is relatively large.Referring to FIGS. 3 and 4 , the temperature of the heating component atthe air inlet is 87 deg. C., while at a position closer to the airoutlet the maximum temperature has reached 104 deg. C. As can be seen,heat dissipation of the heating components 111A is uneven. Whentemperatures of some heating components 111A are too high due to lowheat dissipation efficiency, it might cause working instability, shorterworking life and reduced performance of the entire circuit.

FIGS. 5 and 6 are deployment diagrams of heating components on a circuitboard of the computing device in the disclosure. As shown in FIGS. 5 and6 , a left side of the circuit board 110 provided in the disclosure isclose to an air outlet, and a right side is close to an air inlet. Asshown in the figures, the circuit board 110 is deployed with a pluralityof heating components 111, while these heating components 111 are notequally spaced, and a space between the adjacent heating components isnegatively correlated with heat dissipation efficiency of a region wherethe adjacent heating components are located. Therefore, if the spacebetween the adjacent heating components at the air inlet is small, thespace between the adjacent heating components at the air outlet islarge, so that temperatures of respective heating components on thecircuit board can be balanced.

As can be seen from the figures, the computational heat dissipationstructure deployed with the unequally spaced heating components providedin the disclosure has a maximum temperature of 98.7 deg. C., and aminimum temperature of 95.9 deg. C. with the same rotation speed of thefan as the structure deployed with the equally spaced heating componentsas shown in FIGS. 3 and 4 . As can be seen, with the same rotation speedof the fan, the structure deployed with the unequally spaced heatingcomponents provided by the disclosure enables temperatures of the heatdissipation components in respective regions to keep substantiallybalanced.

The deployed space of the heating components in respective regions ofthe circuit board in this embodiment can be obtained through a largenumber of simulation experiments.

The advantageous effect of the disclosure lies in: since the spacebetween the adjacent heating components is negatively correlated withthe heat dissipation efficiency of the region where the adjacent heatingcomponents are located, i.e., the higher the heat dissipation efficiencyof the region where the adjacent heating components are located is, thesmaller the space between the adjacent heating components in the regionwill be, the heat dissipation efficiencies corresponding to the heatingcomponents are balanced, and load of the fan is reduced.

In one embodiment, as shown in FIG. 1 , the circuit board 110 of thecomputational heat dissipation structure 100 comprises a first side face1101 and a second side face 1102.

In one embodiment, as shown in FIG. 1 , the radiator 120 comprises amain heat sink 121 and an auxiliary heat sink 122, wherein the heatdissipation efficiency of the main heat sink 121 is higher than that ofthe auxiliary heat sink 122.

In this embodiment, the main heat sink 121 carries the circuit board110, which can function to dissipate heat, and also function to supportthe air duct structure, so it functions to dissipate heat and supportsimultaneously.

The auxiliary heat sink 122 presses the circuit board 110 against themain heat sink 121, which can function to dissipate heat, and alsofunction to fix the circuit board 110.

The advantageous effect of this embodiment lies in: since the main heatsink functions to dissipate heat and can also carry the circuit board,it is unnecessary to additionally set other structure for carrying thecircuit board, and it saves cost.

To avoid damage to the heating components 111, in this embodiment, theauxiliary heat sink 122 presses the circuit board 110 against the mainheat sink 121 by the way of resilient press. Through such way of press,it can function to fix, and meanwhile, the heating components 111 arenot easy to damage since the heating components 111 suffer from a smallpressure.

In one embodiment, as shown in FIG. 1 , a thermal conductive material130 is filled in a gap between the auxiliary heat sink 122 and thecircuit board 110, and the thermal conductive material 130 is, forexample, thermal conductive silicone grease or thermal conductive rubberpad.

In this embodiment, since the auxiliary heat sink 122 presses thecircuit board 110 against the main heat sink 121 by the way of resilientpress, a gap exists unavoidably between the auxiliary heat sink 122 andthe circuit board 110 to affect heat dissipation effect. Considering ofsuch case, thermal conductive silicone grease or thermal conductiverubber pad is filled in the gap between the auxiliary heat sink 122 andthe circuit board 110. A heat dissipation area of the circuit board 110is increased in a disguised form by filling thermal conductive siliconegrease or thermal conductive rubber pad in the gap between the auxiliaryheat sink 122 and the circuit board 110, thereby further enhancing theheat dissipation effect of the circuit board 110.

The advantageous effect of this embodiment lies in that the heatdissipation effect of the circuit board is further enhanced by fillingthe thermal conductive material in the gap between the auxiliary heatsink and the circuit board.

In one embodiment, as shown in FIG. 1 , since the heat dissipationefficiency of the main heat sink 121 is higher than that of theauxiliary heat sink 122, the main heat sink 121 can be providedcorresponding to the second side face 1102 of the circuit board 110, andthe auxiliary heat sink 122 can be provided corresponding to the firstside face 1101 of the circuit board 110.

Specifically, the main heat sink 121 comprises a first heat dissipationbody 1211 comprising a first surface and a second surface opposite toeach other, and a first heat dissipation fin 1212 connected to the firstsurface of the first heat dissipation body 1211, and the second surfaceof the first heat dissipation body 1211 connected to the second sideface 1102 of the circuit board 110. The auxiliary heat sink 122comprises a second heat dissipation body 1221 comprising a third surfaceand a fourth surface opposite to each other, and a second heatdissipation fin 1222 connected to the third surface of the second heatdissipation body 1221, and the fourth surface of the second heatdissipation body 1221 connected to the first side face 1101 of thecircuit board 110.

Because of the main heat sink and the auxiliary heat sink, heat on twosides of the circuit board is balanced, thereby further balancing heatof respective regions in the heat-dissipation air duct.

In one embodiment, as shown in FIG. 7 , a computing device 20 comprisesa device housing 21 enclosing an enclosed heat-dissipation air duct 22,and the computational heat dissipation structure 100, wherein thecomputational heat dissipation structure 100 is located in theheat-dissipation air duct 22. The heat-dissipation air duct 22 ismounted with a temperature detecting unit 23 for measuring a temperaturein the heat-dissipation air duct 22.

In one embodiment, as shown in FIG. 8 , a computing device 30 comprisesa device housing 31 enclosing an enclosed heat-dissipation air duct 32,and the computational heat dissipation structure 100, wherein thecomputational heat dissipation structure 100 is located in theheat-dissipation air duct 32. The heat-dissipation air duct 32 ismounted with a plurality of temperature detecting units 33 for measuringtemperatures in the heat-dissipation air duct 32, and the plurality oftemperature detecting units 33 are provided in different regions of theheat-dissipation air duct 32 to real-time detect temperatures ofdifferent regions.

In this embodiment, the temperature detecting units are mounted in theheat-dissipation air duct to record temperatures in the heat-dissipationair duct, so that during working of the computing device, the user canacquire the temperatures in the heat-dissipation air duct, and adjusts arotation speed of the fan.

In one embodiment, as shown in FIG. 7 , the computing device 20 furthercomprises a controller comprising a fan control module and comprises afan 24, the temperature detecting unit 23 and the fan 24 respectivelyelectrically connected to the fan control module. The fan control moduledynamically adjusts a rotation speed of the fan 24 based on thetemperature in the heat-dissipation air duct 22 detected by thetemperature detecting unit 23, so that the fan 24 is avoided to keep ahigh rotation speed for a long time, thereby reducing electric energyloss.

In this embodiment, the rotation speed of the fan is automaticallyadjusted by the fan control module, or manually adjusted by giving aninstruction based on the temperature fed back from the temperaturedetecting unit.

In one embodiment, as shown in FIG. 7 , the heat-dissipation air duct 22comprises an air inlet 221 mounted with a first panel assembly 25, andan air outlet 222 mounted with a second panel assembly 26. The firstpanel assembly 25 and the second panel assembly 26 fix the radiator 120,i.e., the main heat sink 121 and the auxiliary heat sink 122, within theheat-dissipation air duct 22 in parallel.

The fan 24 is, for example, fixed onto the first panel assembly 25 atthe air inlet 221.

In one embodiment, as shown in FIG. 7 , the computing device 20 furthercomprises a fan 27 provided at the air outlet 222, and connected to thesecond panel assembly 26.

In this embodiment, the computing device 20 is provided with the fan 24and the fan 27 on both ends. The fan 24 at the air inlet 221 blows air,and the fan 27 at the air outlet absorbs air, so that a faster and morefluent heat dissipation airflow is formed in the heat-dissipation airduct 22, and the heat dissipation effect is further enhanced.

According to the respective embodiments, it shall be noted that theposition and the number of fan in the disclosure can be adjustedaccording to the need. For example, the fan 27 can be provided only atthe air outlet 222 to suction out air, the fan 24 can be provided onlyat the air inlet 221 to blow air, and the fans also can be provided atboth the air outlet 222 and the air inlet 221 to enhance airflow, butthe disclosure is not limited thereto.

In one embodiment, as shown in FIG. 8 , the heat-dissipation air duct 32is divided into, for example, three temperature zones, which are a firsttemperature zone A, a second temperature zone B, and a third temperaturezone C, respectively. The temperature detecting units are, for example,three, which are the temperature detecting units 33A, 33B and 33C,respectively, and the temperature detecting units 33A, 33B and 33Crespectively detect temperatures of the first temperature zone A, thesecond temperature zone B, and the third temperature zone C of theheat-dissipation air duct 32. Of course, each temperature zone can alsocorrespond to more than one temperature detecting unit.

The first temperature zone A, the second temperature zone B, and thethird temperature zone C correspond to a part of the heating componentson the circuit board 110, respectively.

The controller of the computing device 30 further comprises a chipcontrol module electrically connected to the temperature detecting units33A, 33B and 33C, wherein the chip control module adjusts dynamicallyworking frequencies of the heating components in the temperature zoneswhere the temperature detecting units 33A, 33B and 33C are located basedon the temperatures of different temperature zones A, B and C in theheat-dissipation air duct 32 detected by the temperature detecting units33A, 33B and 33C.

For example, when the temperature of the third temperature zone Cdetected by the temperature detecting unit 33C is too high, the chipcontrol module controls a part of the heating components 111Ccorresponding to the third temperature zone C to reduce the workingfrequencies, so as to decrease the heat of this part of the heatingcomponents 111C, and balance the heat dissipation efficiencies ofrespective heating components.

In this embodiment, life of the heating components can be prolonged, andproblems of too much noise due to long-time overload working of the fan,and overall working efficiency affected by damage of the fan and thecircuit can be avoided by reducing the working efficiencies of a part ofthe heating components in an overheating region.

FIG. 9 is a structure diagram of a computational heat dissipationstructure according to one embodiment of the disclosure. In oneembodiment, as shown in FIG. 9 , the computational heat dissipationstructure 200 comprises a circuit board 210 and a radiator. The circuitboard 210 is provided with a plurality of heating components 211, whichare unequally spaced, and a space between the adjacent heatingcomponents 211 is negatively correlated with heat dissipation efficiencyof a region where the adjacent heating components 211 are located.

The radiator comprises a main heat sink (not shown) and an auxiliaryheat sink provided on two side faces of the circuit board 210respectively. For example, there may be a plurality of auxiliary heatsinks 222 b, each being provided corresponding to one of the heatingcomponents 211. Of course, each auxiliary heat sink 222 a may also beprovided corresponding to more of the heating components 211. It shallbe noted that in different embodiments, the number of circuit board 210may be one or more, but the disclosure is not limited thereto.

According to the disclosure, there may be only one computational heatdissipation structure in the heat-dissipation air duct as the computingdevice shown in FIGS. 1, 7 and 8 , and alternatively there may be twocomputational heat dissipation structures 100 a and 110 b in aheat-dissipation air duct 42 as a computing device 40 shown in FIG. 10 ,wherein the computational heat dissipation structures 100 a and 110 bare symmetrically provided. Of course, more computational heatdissipation structures can also be included.

The computing device of the disclosure can be a computing device for avirtual coin mining machine, and a mine in the disclosure refers to aplace where a large number of mining machines are gathered for virtualcoin mining.

The structure of the mine in one embodiment of the disclosure is shownin FIG. 11 . The mine 1 comprises at least one setting frame 1A providedwith at least one computing device of the disclosure, for example, thecomputing device 10. It shall be noted that the setting frame 1A canhave computing devices in various ways, for example, parallel and stack,and the structure and the form of the setting frame 1A are not limitedto the figures.

Of course, the disclosure also can have other various embodiments, andthose skilled in the art can make various corresponding modificationsand variations based on the disclosure without departing from spirit andessence of the disclosure, but these corresponding modifications andvariations shall belong to the scope protected by the appended claims ofthe disclosure.

INDUSTRIAL APPLICABILITY

Since the space between the adjacent heating components is negativelycorrelated with the heat dissipation efficiency of the region where theadjacent heating components are located, i.e., the higher the heatdissipation efficiency of the region where the adjacent heatingcomponents are located is, the smaller the space between the adjacentheating components in the region will be, the computational heatdissipation structure and the computing device provided by thedisclosure balance the heat dissipation efficiencies of respectiveheating components, and reduce load of the fan. Therefore, the mineprovided by the disclosure avoids the problem of overheating damage ofthe heating components even if a large number of computing devices aregathered in the same space.

What is claimed is:
 1. A circuit board, comprising a plurality ofheat-generating components, wherein a spacing between adjacentheat-generating components of the plurality of heat-generatingcomponents is negatively correlated with a heat dissipation efficiencyof a region where the adjacent heat-generating components are located,wherein: the plurality of heat-generating components comprise at leastone row of heat-generating components along a direction of airflow; andalong the direction of airflow, average spacing among first three of theat least one row of heat-generating components is smaller than averagespacing among last three of the at least one row of heat-generatingcomponents.
 2. The circuit board of claim 1, wherein: along thedirection of airflow, spacing of at least three pairs of adjacentheat-generating components among the at least one row of heat-generatingcomponents are different.
 3. The circuit board of claim 1, wherein: theplurality of heat-generating components comprises twenty or moreheat-generating components; and at least some of the plurality ofheat-generating components are symmetrically distributed with respect toan axis parallel to a direction of airflow.
 4. The circuit board ofclaim 1, wherein: the circuit board is disposed in a heat-dissipationair duct; and a direction of airflow is a direction from an air inlet ofthe heat-dissipation air duct to an air outlet of the heat-dissipationair duct.
 5. The circuit board of claim 1, wherein: the plurality ofheat-generating components have identical sizes; or heat-generatingareas of the plurality of heat-generating components are identical. 6.The circuit board of claim 1, wherein: the plurality of heat-generatingcomponents are distributed in rows, and in each of the rows, centers ofat least three heat-generating components are distributed along a line;or the plurality of heat-generating components are distributed incolumns, and in each of the columns, centers of at least threeheat-generating components are distributed along a line.
 7. The circuitboard of claim 6, wherein for at least one of the rows, spacing of atleast two adjacent heat-generating components of the at least one row isnegatively correlated with a heat dissipation efficiency of a regionwhere the adjacent heat-generating components of the at least one roware located.
 8. The circuit board of claim 6, wherein: the circuit boardis disposed in a heat-dissipation air duct; the heat-dissipation airduct comprises an air inlet; and for at least one of the rows, spacingof at least two adjacent heat-generating components of the at least onerow is positively correlated with a distance from the air inlet to theat least two adjacent heat-generating components of the at least onerow.
 9. The circuit board of claim 6, wherein: the circuit board isdisposed in a heat-dissipation air duct; the heat-dissipation air ductcomprises an air inlet and an air outlet; and for at least one of therows, spacing of adjacent heat-generating components of the at least onerow closer to the air inlet is smaller than spacing of adjacentheat-generating components of the at least one row closer to the airoutlet.
 10. The circuit board of claim 6, wherein: the plurality ofheat-generating components are distributed in an even number of rows;and a direction along each of the rows is in parallel with a directionfrom an air inlet of a heat-dissipation air duct to an air outlet of theheat-dissipation air duct.
 11. The circuit board of claim 6, wherein:the circuit board is disposed in a heat-dissipation air duct; theheat-dissipation air duct comprises an air inlet and an air outlet; adirection along each of the rows is in parallel with a direction fromthe air inlet to the air outlet; and a direction along each of thecolumns is perpendicular to the direction along each of the rows. 12.The circuit board of claim 11, wherein: along the direction from the airinlet to the air outlet, average spacing among adjacent heat-generatingcomponents of first three columns of the plurality of heat-generatingcomponents is smaller than average spacing among adjacentheat-generating components of last three columns of the plurality ofheat-generating components; or along the direction from the air inlet tothe air outlet, a length of first three columns of the plurality ofheat-generating components is smaller than a length of last threecolumns of the plurality of heat-generating components, wherein thelength is a dimension parallel to the direction from the air inlet tothe air outlet and parallel to a plane of the circuit board.
 13. Thecircuit board of claim 11, wherein: at least one of the rows comprises afirst heat-generating component and a second heat-generating componentdisposed along the direction from the air inlet to the air outlet; thefirst heat-generating component is closest to the air inlet among the atleast one row of heat-generating components; the second heat-generatingcomponent is second closest to the air inlet among the at least one rowof heat-generating components; and spacing between the firstheat-generating component and the second heat-generating component issmaller than a distance between the first heat-generating component andan edge of the circuit board closest to the air inlet.
 14. The circuitboard of claim 11, wherein: at least one of the rows comprises a firstheat-generating component and a last heat-generating component disposedalong the direction from the air inlet to the air outlet; the firstheat-generating component is closest to the air inlet among the at leastone row of heat-generating components; the last heat-generatingcomponent is closest to the air outlet among the at least one row ofheat-generating components; and a distance between the firstheat-generating component and an edge of the circuit board closest tothe air inlet is smaller than a distance between the lastheat-generating component and an edge of the circuit board closest tothe air outlet.
 15. The circuit board of claim 11, wherein: the at leastone rows is disposed between a first edge and a second edge of thecircuit board; the rows comprise a first row closest to the first edgeand a second row closest to the second edge; and a distance between thefirst row to the first edge is substantially same as a distance betweenthe second row to the second edge.
 16. The circuit board of claim 11,wherein: a number of heat-generating components of each of the rows islarger than a number of heat-generating components of each of thecolumns; or the number of heat-generating components of each of the rowsis more than twice the number of heat-generating components of each ofthe columns.
 17. The circuit board of claim 1, wherein: the circuitboard is disposed in a heat-dissipation air duct; the circuit boardcomprises a first edge and a second edge both in parallel with adirection from an air inlet of the heat-dissipation air duct to an airoutlet of the heat-dissipation air duct; the plurality ofheat-generating components are distributed in rows between the firstedge and the second edge; the rows comprise a first row and a secondrow; the first row and the second row are closer to the first edge thanthe second edge; the first row is closer to the first edge than thesecond row; and in a working state, an average temperature ofheat-generating components of the first row excluding a firstheat-generating component closest to the air inlet of theheat-dissipation air duct among the first row is smaller than an averagetemperature of heat-generating components of the second row excluding adifferent first heat-generating component closest to the air inlet ofthe heat-dissipation air duct among the second row.
 18. The circuitboard of claim 1, wherein: the circuit board is disposed in aheat-dissipation air duct; the circuit board comprises a first edge anda second edge both in parallel with a direction from an air inlet of theheat-dissipation air duct to an air outlet of the heat-dissipation airduct; the plurality of heat-generating components are distributed inrows between the first edge and the second edge; the rows comprise afirst row and a second row; the first row and the second row are closerto the first edge than the second edge; the first row is closer to thefirst edge than the second row; and in a working state, an averagetemperature of heat-generating components of the first row is smallerthan an average temperature of heat-generating components of the secondrow.
 19. The circuit board of claim 1, wherein, along a direction ofheat-dissipation, the spacing between adjacent heat-generatingcomponents of the plurality of heat-generating components is negativelycorrelated with the heat dissipation efficiency of the region where theadjacent heat-generating components are located.
 20. The circuit boardof claim 1, comprising two parallel long edges and two parallel shortedges, wherein: each of the long edges is longer than each of the shortedges; the plurality of heat-generating components comprise one or morefirst lines of heat-generating components distributed along the longedges; the plurality of heat-generating components comprise one or moresecond lines of heat-generating components distributed along the shortedges; and a number of heat-generating components in each of the one ormore first lines is more than a number of heat-generating components ineach of the one or more second lines.
 21. A heat dissipation structure,comprising a plurality of heat-generating components, wherein a spacingbetween adjacent heat-generating components of the plurality ofheat-generating components is negatively correlated with a heatdissipation efficiency of a region where the adjacent heat-generatingcomponents are located, wherein: the plurality of heat-generatingcomponents comprise at least one row of heat-generating components alonga direction of airflow; and along the direction of airflow, averagespacing among first three of the at least one row of heat-generatingcomponents is smaller than average spacing among last three of the atleast one row of heat-generating components.
 22. The heat dissipationstructure of claim 21, comprising a circuit board and at least oneradiator, wherein: the circuit board comprises the plurality ofheat-generating components; and the at least one radiator is disposed ona first side surface or a second side surface or both the first sidesurface and the second side surface of the circuit board.
 23. The heatdissipation structure of claim 22, wherein: the heat dissipationstructure is disposed in a heat-dissipation air duct; the at least oneradiator comprises a heat sink; the heat sink comprises a heatdissipation body and a plurality of heat dissipation fins; the pluralityof heat dissipation fins are connected with a first surface of the heatdissipation body; a second surface of the heat dissipation body isdisposed on the first side surface of the circuit board; the pluralityof heat dissipation fins are evenly spaced or have a uniform thickness;and the thickness is a dimension along a direction parallel to a planeof the circuit board and normal to a direction from an air inlet to anair outlet of the heat-dissipation air duct.
 24. The heat dissipationstructure of claim 22, wherein: the heat dissipation structure isdisposed in a heat-dissipation air duct; the at least one radiatorcomprises a heat sink; the heat sink comprises a heat dissipation bodyand a plurality of heat dissipation fins; the plurality of heatdissipation fins are connected with a third surface of the heatdissipation body; a fourth surface of the heat dissipation body isdisposed on the side surface of the circuit board; and the plurality ofheat dissipation fins are evenly spaced, or the plurality of heatdissipation fins have a uniform thickness, wherein the thickness is adimension along a direction parallel to a plane of the circuit board andnormal to a direction from an air inlet of the heat-dissipation air ductto an air outlet of the heat-dissipation air duct, or the plurality ofheat dissipation fins have a uniform length, wherein the length is adimension along a direction normal to a plane of the circuit board, oralong the direction from the air inlet of the heat-dissipation air ductto the air outlet of the heat-dissipation air duct, the uniform lengthof the plurality of heat dissipation fins is unchanged.
 25. The heatdissipation structure of claim 22, wherein: the heat dissipationstructure is disposed in a heat-dissipation air duct; the at least oneradiator comprises a first heat sink; the first heat sink comprises afirst heat dissipation body and a plurality of first heat dissipationfins; the plurality of first heat dissipation fins are connected with afirst surface of the first heat dissipation body; a second surface ofthe first heat dissipation body is disposed on the first side surface ofthe circuit board; and the first heat sink is configured to carry thecircuit board.
 26. The heat dissipation structure of claim 25, wherein:other than the first heat sink, the heat dissipation structure comprisesno component configured to carry the circuit board.
 27. The heatdissipation structure of claim 25, wherein: the first heat sink isconfigured to support the heat-dissipation air duct.
 28. The heatdissipation structure of claim 22, wherein: the at least one radiatorcomprises a first heat sink and a second heat sink; the first heat sinkcomprises a first heat dissipation body and a plurality of first heatdissipation fins; the plurality of first heat dissipation fins areconnected with a first surface of the first heat dissipation body; asecond surface of the first heat dissipation body is disposed on thefirst side surface of the circuit board; the second heat sink comprisesa second heat dissipation body and a plurality of second heatdissipation fins; the plurality of second heat dissipation fins areconnected with a third surface of the second heat dissipation body; afourth surface of the second heat dissipation body is disposed on thesecond side surface of the circuit board; and a length of the first heatdissipation body is larger than a length of the second heat dissipationbody, wherein the length is a dimension parallel to a direction from anair inlet to an air outlet of a heat-dissipation air duct and parallelto a plane of the circuit board.
 29. The heat dissipation structure ofclaim 22, wherein: the at least one radiator comprises a first heat sinkand a second heat sink; the first heat sink comprises a first heatdissipation body and a plurality of first heat dissipation fins; theplurality of first heat dissipation fins are connected with a firstsurface of the first heat dissipation body; a second surface of thefirst heat dissipation body is disposed on the first side surface of thecircuit board; the second heat sink comprises a second heat dissipationbody and a plurality of second heat dissipation fins; the plurality ofsecond heat dissipation fins are connected with a third surface of thesecond heat dissipation body; and a fourth surface of the second heatdissipation body is disposed on the second side surface of the circuitboard.
 30. The heat dissipation structure of claim 29, wherein: the heatdissipation structure is disposed in a heat-dissipation air duct; alength of the first heat dissipation body is larger than a length of thecircuit board; and each of the length of the first heat dissipation bodyand the length of the circuit board is a dimension along a directionparallel to a plane of the circuit board and normal to a direction froman air inlet to an air outlet of the heat-dissipation air duct.
 31. Theheat dissipation structure of claim 29, wherein: the heat dissipationstructure is disposed in a heat-dissipation air duct; a thickness of thefirst heat dissipation body is larger than a thickness of the secondheat dissipation body; and each of the thickness of the first heatdissipation body and the thickness of the second heat dissipation bodyis a dimension along a direction normal to a plane of the circuit boardand normal to a direction from an air inlet to an air outlet of theheat-dissipation air duct.
 32. The heat dissipation structure of claim29, wherein: the heat dissipation structure is disposed in aheat-dissipation air duct; a length of the first heat dissipation bodyis different from a length of the second heat dissipation body; and eachof the length of the first heat dissipation body and the length of thesecond heat dissipation body is a dimension along a direction parallelto a plane of the circuit board and normal to a direction from an airinlet to an air outlet of the heat-dissipation air duct.
 33. The heatdissipation structure of claim 32, wherein: the length of the first heatdissipation body is larger than the length of the second heatdissipation body.
 34. The heat dissipation structure of claim 29,wherein: the heat dissipation structure is disposed in aheat-dissipation air duct; a length of each of the plurality of firstheat dissipation fins is larger than a length of each of the pluralityof second heat dissipation fins; and each of the length of each of theplurality of first heat dissipation fins and the length of each of theplurality of second heat dissipation fins is a dimension along adirection normal to a plane of the circuit board.
 35. The heatdissipation structure of claim 29, wherein: a thickness of each of theplurality of first heat dissipation fins is different from a thicknessof each of the plurality of second heat dissipation fins; or spacingbetween adjacent fins of the plurality of first heat dissipation fins isdifferent from spacing between adjacent fins of the plurality of secondheat dissipation fins.
 36. The heat dissipation structure of claim 22,wherein: no heat-generating component is disposed on the first sidesurface; or the plurality of heat-generating components are disposed onthe second side surface.
 37. The heat dissipation structure of claim 22,wherein: the at least one radiator comprises a first heat sink and asecond heat sink; and a heat dissipation efficiency of the first heatsink is larger than a heat dissipation efficiency of the second heatsink.
 38. The heat dissipation structure of claim 22, wherein: when thecircuit board is in a working state, an amount of heat outputted fromthe first side surface is larger than an amount of heat outputted fromthe second side surface.
 39. The heat dissipation structure of claim 22,wherein: the at least one radiator comprises a second heat sink; and agap between the second heat sink and the circuit board is filled withthermal conductive silicone grease or thermal conductive rubber pad. 40.The heat dissipation structure of claim 22, wherein: the at least oneradiator comprises a first heat sink and a second heat sink; and thesecond heat sink is configured to press the circuit board against thefirst heat sink.
 41. The heat dissipation structure of claim 22,wherein: the at least one radiator comprises a second heat sink; and thesecond heat sink comprises at least two bulges disposed on at least someof the plurality of heat-generating components.
 42. The heat dissipationstructure of claim 41, wherein each of the plurality of heat-generatingcomponents is in contact with one of the at least two bulges.
 43. Theheat dissipation structure of claim 41, wherein: the circuit board andthe second heat sink are disposed in a heat-dissipation air duct; theplurality of heat-generating components are distributed in rows eachalong a direction from an air inlet to an air outlet of theheat-dissipation air duct; and each of the rows is in contact with oneof the at least two bulges.
 44. A computing device, comprising: aplurality of heat-generating components, wherein a spacing betweenadjacent heat-generating components of the plurality of heat-generatingcomponents is negatively correlated with a heat dissipation efficiencyof a region where the adjacent heat-generating components are located;and a heat dissipation structure and a housing enclosing aheat-dissipation air duct, wherein: the heat dissipation structurecomprises a circuit board and at least one radiator, the circuit boardcomprises the plurality of heat-generating components; the at least oneradiator is disposed on a first side surface or a second side surface orboth the first side surface and the second side surface of the circuitboard; the at least one radiator comprises a first heat sink and asecond heat sink, the second heat sink configured to press the circuitboard against the first heat sink.
 45. The computing device of claim 44,wherein: the heat dissipation structure is disposed in theheat-dissipation air duct.
 46. The computing device of claim 44,wherein: the housing comprises a panel assembly and a different panelassembly; and the panel assembly and the different panel assembly areconfigured to fix the first heat sink and the second heat sink inparallel inside the heat-dissipation air duct.
 47. The computing deviceof claim 44, wherein: the housing comprises a panel assembly and adifferent panel assembly; and the panel assembly and the different panelassembly are normal to a plane of the circuit board.
 48. The computingdevice of claim 44, wherein: the first heat sink comprises a pluralityof first heat dissipation fins; the second heat sink comprises aplurality of second heat dissipation fins; the housing comprises a panelassembly and a different panel assembly; and the panel assembly and thedifferent panel assembly are in parallel to the plurality of first heatdissipation fins and the plurality of second heat dissipation fins. 49.The computing device of claim 44, wherein: a shortest distance betweenthe heat dissipation structure and a bottom surface of the housing issmaller than a length of each of the plurality of heat-generatingcomponents; or a shortest distance between the heat dissipationstructure and a side surface of the housing is smaller than the lengthof each of the plurality of heat-generating components.
 50. Thecomputing device of claim 44, wherein: a smallest distance between aheat sink of the heat dissipation structure and a bottom of the housingis less than a length or width of each of the plurality ofheat-generating components; or a smallest distance between a heatdissipation body of a heat sink of the heat dissipation structure andthe bottom of the housing is less than the length or width of each ofthe plurality of heat-generating components.
 51. The computing device ofclaim 44, wherein: a space forms between the heat dissipation structureand a top surface of the housing, a height of the space is a dimensionalong a direction parallel to a plane of the circuit board and normal toa direction from an air inlet to an air outlet of the heat-dissipationair duct; and the height of the space is smaller than a length of afirst heat dissipation body of the first heat sink of the at least oneradiator, wherein the length of the first heat dissipation body is adimension along a direction parallel to a plane of the circuit board andnormal to the direction from the air inlet to the air outlet of theheat-dissipation air duct, or the height of the space is smaller than alength of a second heat dissipation body of the second heat sink of theat least one radiator, wherein the length of the second heat dissipationbody is the dimension along the direction parallel to a plane of thecircuit board and normal to the direction from the air inlet to the airoutlet of the heat-dissipation air duct, or the height of the space issmaller than a length of each of a plurality of first heat dissipationfins or larger than a length of each of a plurality of second heatdissipation fins, wherein each of the length of the plurality of firstheat dissipation fins and the length of the plurality of second heatdissipation fins is a dimension along a direction normal to the plane ofthe circuit board.
 52. The computing device of claim 44, wherein: atleast one temperature detector is disposed in the heat-dissipation airduct and configured to measure at least one temperature in theheat-dissipation air duct; the heat-dissipation air duct is providedwith at least one fan; the at least one temperature detector and the atleast one fan are coupled to a controller; and the controller isconfigured to monitor the at least one temperature and control arotation speed of the at least one fan based on the at least onetemperature.
 53. The computing device of claim 44, wherein: theheat-dissipation air duct comprises an air inlet and an air outlet; andthe computing device further comprises a first panel assembly disposedat the air inlet and a second panel assembly disposed at the air outlet.54. The computing device of claim 44, wherein: the heat dissipationstructure is in connection with a space between the heat dissipationstructure and a top surface of the housing.
 55. A mine, comprising atleast one frame provided with at least one computing device, wherein theat least one computing device is the computing device of claim 44.